Characterisation of insulated Cu wire ball bonding
Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...
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Main Authors: | Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M. |
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Other Authors: | 55787052600 |
Format: | Article |
Published: |
Maney Publishing
2023
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