Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress
Quality requirement in the semiconductor industry is getting more stringent due to the application of semiconductor components that are widely used in automotive. Furthermore different materials combination is being introduced to semiconductor packages to improve their package performance and reduce...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English English |
| Published: |
UTeM
2017
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/23786/1/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress%20-%20Lee%20Cher%20Chia%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23786/2/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress.pdf http://eprints.utem.edu.my/id/eprint/23786/ http://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109161 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Internet
http://eprints.utem.edu.my/id/eprint/23786/1/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress%20-%20Lee%20Cher%20Chia%20-%2024%20Pages.pdfhttp://eprints.utem.edu.my/id/eprint/23786/2/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress.pdf
http://eprints.utem.edu.my/id/eprint/23786/
http://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109161