C45 ultra low k wafer technology with Cu wire bonding
As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonde...
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| 主要な著者: | , , , , , , , , , , |
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| フォーマット: | Conference Paper |
| 出版事項: |
2023
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