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Characterisation of insulated Cu wire ball bonding

Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...

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Main Authors: Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.
Other Authors: 55787052600
Format: Article
Published: Maney Publishing 2023
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spelling my.uniten.dspace-218202023-05-16T10:45:34Z Characterisation of insulated Cu wire ball bonding Leong H.Y. Yap B.K. Khan N. Ibrahim M.R. Tan L.C. Faiz M. 55787052600 26649255900 9736201900 16021986000 57661553500 56450441300 Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and bare Cu wire ball-bonding process characterisation in the standpoints of free air ball formation, Al splash, hardness, ball bond strength and intermetallic growth at the bond interface study. Spherical and clean free air ball was formed using lower electric flame off energy compared to bare Cu wire. The study shows that insulated Cu bonding demonstrated comparable equivalent ball bond strength to bare Cu wire bonding at T0 and even after subjected to isothermal aging 175°C up to 1008 hours. Intermetallic formation was uniform at the bond interface for both wires. Insulated Cu wire demonstrates good bondability and reliability performance, suitable for fine pitch wire bonding in large-scale integration applications. © 2014 W. S. Maney & Son Ltd. Final 2023-05-16T02:45:33Z 2023-05-16T02:45:33Z 2014 Article 10.1179/1432891714Z.0000000001019 2-s2.0-84918795833 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84918795833&doi=10.1179%2f1432891714Z.0000000001019&partnerID=40&md5=4e54ecd8297e28ddef9ce8231ed2e79c https://irepository.uniten.edu.my/handle/123456789/21820 18 S6 269-S6-273 Maney Publishing Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and bare Cu wire ball-bonding process characterisation in the standpoints of free air ball formation, Al splash, hardness, ball bond strength and intermetallic growth at the bond interface study. Spherical and clean free air ball was formed using lower electric flame off energy compared to bare Cu wire. The study shows that insulated Cu bonding demonstrated comparable equivalent ball bond strength to bare Cu wire bonding at T0 and even after subjected to isothermal aging 175°C up to 1008 hours. Intermetallic formation was uniform at the bond interface for both wires. Insulated Cu wire demonstrates good bondability and reliability performance, suitable for fine pitch wire bonding in large-scale integration applications. © 2014 W. S. Maney & Son Ltd.
author2 55787052600
author_facet 55787052600
Leong H.Y.
Yap B.K.
Khan N.
Ibrahim M.R.
Tan L.C.
Faiz M.
format Article
author Leong H.Y.
Yap B.K.
Khan N.
Ibrahim M.R.
Tan L.C.
Faiz M.
spellingShingle Leong H.Y.
Yap B.K.
Khan N.
Ibrahim M.R.
Tan L.C.
Faiz M.
Characterisation of insulated Cu wire ball bonding
author_sort Leong H.Y.
title Characterisation of insulated Cu wire ball bonding
title_short Characterisation of insulated Cu wire ball bonding
title_full Characterisation of insulated Cu wire ball bonding
title_fullStr Characterisation of insulated Cu wire ball bonding
title_full_unstemmed Characterisation of insulated Cu wire ball bonding
title_sort characterisation of insulated cu wire ball bonding
publisher Maney Publishing
publishDate 2023
_version_ 1806426461236625408
score 13.223943

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