Influence of laser power on bonding strength for low purity copper wire bonding technology
The drive for improving copper wire bonding has been more rampant with continued rise in gold prices. The global increase in gold price directly resulted the semiconductor packaging industry to rapidly replace gold as a medium of interconnection to copper wire. This is a cost effective solution for...
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| Main Authors: | , |
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| Format: | Article |
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Elsevier
2019
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| Online Access: | http://eprints.um.edu.my/23422/ https://doi.org/10.1016/j.mee.2019.03.018 |
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