Stitch Bonding Strength of Cu Wire on AuAg/Pd/Ni Preplated Cu Leadframes: Influence of AuAg Thickness
Copper (Cu) wire bonding on the pre-plated leadframes with Ni/Pd/AuAg plating has been applied extensively in the semiconductor industry for the interconnection of integrated-circuit (IC) packaging due to the lower material cost of Cu and its excellent electrical properties. Furthermore, the Cu wir...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2015
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/17769/1/AMM.761.364%20%281%29.pdf http://eprints.utem.edu.my/id/eprint/17769/ http://www.scientific.net/AMM |
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