Effect of Pedestal Temperature on Bonding Strength and Deformation Characteristics for 5N Copper Wire Bonding
In recent years, copper has increasingly been used to replace gold to create wire-bonded interconnections in microelectronics. While engineers and researchers in the semiconductor packaging field are continuously working on this transition from gold to copper wires to reduce costs, the challenge rem...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE)
2016
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/17446/ http://dx.doi.org/10.1007/s11664-016-4403-y |
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