Non-sticking on ground ring improvement for copper wire bonding with DMAIC approach
Semiconductor industries are in the process of converting gold wire bonding to copper wire bonding because of significant cost saving from gold price.The conversion from gold to copper also gives rise to many challenges due to the copper wire properties.Copper wire bonding is very sensitive to the c...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2016
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/20567/1/Non-sticking%20on%20ground%20ring%20improvement%20for%20copper%20wire%20bonding%20with%20DMAIC%20approach.pdf http://eprints.utem.edu.my/id/eprint/20567/2/Non-sticking%20on%20ground%20ring%20improvement%20for%20copper%20wire%20bonding%20with%20DMAIC%20approach.pdf http://eprints.utem.edu.my/id/eprint/20567/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104973 |
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Internet
http://eprints.utem.edu.my/id/eprint/20567/1/Non-sticking%20on%20ground%20ring%20improvement%20for%20copper%20wire%20bonding%20with%20DMAIC%20approach.pdfhttp://eprints.utem.edu.my/id/eprint/20567/2/Non-sticking%20on%20ground%20ring%20improvement%20for%20copper%20wire%20bonding%20with%20DMAIC%20approach.pdf
http://eprints.utem.edu.my/id/eprint/20567/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104973