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The evolutions of microstructure in pressureless sintered silver die attach material

Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric a...

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書誌詳細
主要な著者:	Omar, Ghazali, Esa, Siti Rahmah, Sheikh Md Fadzullah, Siti Hajar, Siow, Kim Shyong, Abdul Rahim, Bazura
フォーマット:	論文
言語:	English
出版事項:	Universiti Malaysia Perlis 2021
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF http://eprints.utem.edu.my/id/eprint/25742/ https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf
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