Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
Ball grid array (BGA) packages are essential components in automotive applications, renowned for their compact form factor and high-density interconnections. However, the persistent issue of void formation within these packages poses a significant challenge to their performance and reliability. This...
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| Format: | Thesis |
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2024
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| Online Access: | http://studentsrepo.um.edu.my/15386/2/Ng_Qian_Qing.pdf http://studentsrepo.um.edu.my/15386/1/Ng_Qian_Qing.pdf http://studentsrepo.um.edu.my/15386/ |
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