Evaluation of different die attach film and epoxy pastes for stacked die QFN package
The trend in the semiconductor industry is to develop more powerful components while decreasing the component size. A suitable material set has to be obtained for the required reliability performance. The objective of this study is to evaluate the performance of different die attach film (DAF) and e...
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| Main Authors: | , , , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5291 |
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