Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

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Main Authors: Mohd Azli, Salim, Ameeruz Kamal, Ab Wahid, Nor Azmmi, Masripan, Chonlatee, Photong, Adzni, Md. Saad, Mohd Zaid, Akop, Muhd Ridzuan, Mansor
其他作者: azli@utem.edu.my
格式: Article
语言:English
出版: Universiti Malaysia Perlis (UniMAP) 2022
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在线阅读:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/76072
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