صورة الغلاف

The evolutions of microstructure in pressureless sintered silver die attach material

Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric a...

وصف كامل

محفوظ في:
التفاصيل البيبلوغرافية
المؤلفون الرئيسيون: Omar, Ghazali, Esa, Siti Rahmah, Sheikh Md Fadzullah, Siti Hajar, Siow, Kim Shyong, Abdul Rahim, Bazura
التنسيق: مقال
اللغة:English
منشور في: Universiti Malaysia Perlis 2021
الوصول للمادة أونلاين:http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF
http://eprints.utem.edu.my/id/eprint/25742/
https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf
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الانترنت

http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF
http://eprints.utem.edu.my/id/eprint/25742/
https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf

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