Study on reliability test of die attach material

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing prob...

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Main Authors: Yik L.C., Kar Y.B., Shafika N.
其他作者: 55787504300
格式: Conference paper
出版: 2023
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