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The evolutions of microstructure in pressureless sintered silver die attach material

Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric a...

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Main Authors: Omar, Ghazali, Esa, Siti Rahmah, Sheikh Md Fadzullah, Siti Hajar, Siow, Kim Shyong, Abdul Rahim, Bazura
Format: Article
Language:English
Published: Universiti Malaysia Perlis 2021
Online Access:http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF
http://eprints.utem.edu.my/id/eprint/25742/
https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf
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spelling my.utem.eprints.257422023-07-20T15:43:56Z http://eprints.utem.edu.my/id/eprint/25742/ The evolutions of microstructure in pressureless sintered silver die attach material Omar, Ghazali Esa, Siti Rahmah Sheikh Md Fadzullah, Siti Hajar Siow, Kim Shyong Abdul Rahim, Bazura Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric adhesive binder at 200 °C, 250 °C, 275 °C, and 300 °C for a duration of 2 hours. The grains, particles, and neck growth observed via two-dimensional Focused Ion Beam (FIB) cuts on the samples at different sintering temperatures were associated with the atomic motions and reduction of surface energy that is the driving force for sintering. In this study, the pressureless sintering process in a polymeric adhesive binder successfully transformed the scattered Ag particles into a compact and dense Ag joining at 300 °C. The electrical conductivity value obtained at 300 °C was 5.2E+05 S/cm, which was the highest among the evaluation samples. Universiti Malaysia Perlis 2021-04 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF Omar, Ghazali and Esa, Siti Rahmah and Sheikh Md Fadzullah, Siti Hajar and Siow, Kim Shyong and Abdul Rahim, Bazura (2021) The evolutions of microstructure in pressureless sintered silver die attach material. International Journal of Nanoelectronics and Materials, 14 (2). pp. 179-194. ISSN 1985-5761 https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure evolutions of Ag particles under pressureless sintering in a polymeric adhesive binder at 200 °C, 250 °C, 275 °C, and 300 °C for a duration of 2 hours. The grains, particles, and neck growth observed via two-dimensional Focused Ion Beam (FIB) cuts on the samples at different sintering temperatures were associated with the atomic motions and reduction of surface energy that is the driving force for sintering. In this study, the pressureless sintering process in a polymeric adhesive binder successfully transformed the scattered Ag particles into a compact and dense Ag joining at 300 °C. The electrical conductivity value obtained at 300 °C was 5.2E+05 S/cm, which was the highest among the evaluation samples.
format Article
author Omar, Ghazali
Esa, Siti Rahmah
Sheikh Md Fadzullah, Siti Hajar
Siow, Kim Shyong
Abdul Rahim, Bazura
spellingShingle Omar, Ghazali
Esa, Siti Rahmah
Sheikh Md Fadzullah, Siti Hajar
Siow, Kim Shyong
Abdul Rahim, Bazura
The evolutions of microstructure in pressureless sintered silver die attach material
author_facet Omar, Ghazali
Esa, Siti Rahmah
Sheikh Md Fadzullah, Siti Hajar
Siow, Kim Shyong
Abdul Rahim, Bazura
author_sort Omar, Ghazali
title The evolutions of microstructure in pressureless sintered silver die attach material
title_short The evolutions of microstructure in pressureless sintered silver die attach material
title_full The evolutions of microstructure in pressureless sintered silver die attach material
title_fullStr The evolutions of microstructure in pressureless sintered silver die attach material
title_full_unstemmed The evolutions of microstructure in pressureless sintered silver die attach material
title_sort evolutions of microstructure in pressureless sintered silver die attach material
publisher Universiti Malaysia Perlis
publishDate 2021
url http://eprints.utem.edu.my/id/eprint/25742/2/IJNEAM2021015_THE%20EVOLUTION%20OF%20MICROSTRUCTURE%20IN%20PRESSURELESS%20SINTERED%20SILVER%20DIE%20ATTACH%20MATERIALS.PDF
http://eprints.utem.edu.my/id/eprint/25742/
https://ijneam.unimap.edu.my/images/PDF/IJNEAM-%20Regular%20Issue%20APRIL%202021%20pdf/IJNEAM2021015_Final_pr_Verified%20(1).pdf
_version_ 1772816023188144128
score 13.211869

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