Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Emerald
2015
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/15662/1/Mechanical_properties_of_interfacial_phases_between_Sn-3.5_Ag_solder_and_Ni-18_at..pdf http://eprints.um.edu.my/15662/ http://www.emeraldinsight.com/doi/full/10.1108/SSMT-01-2015-0001 |
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