Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperat...
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| 主要な著者: | , , |
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2017
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| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5208 |
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