Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI
2016
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/17440/1/HaseebASMA_%282016%29.pdf http://eprints.um.edu.my/17440/ http://dx.doi.org/10.3390/ma9070522 |
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