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Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation

Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study...

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Main Authors: Chew, C.S., Durairaj, R., Haseeb, A.S. Md. Abdul, Beake, B.
Format: Article
Language:English
Published: Emerald 2015
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/15662/1/Mechanical_properties_of_interfacial_phases_between_Sn-3.5_Ag_solder_and_Ni-18_at..pdf
http://eprints.um.edu.my/15662/
http://www.emeraldinsight.com/doi/full/10.1108/SSMT-01-2015-0001
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spelling my.um.eprints.156622018-10-17T00:43:25Z http://eprints.um.edu.my/15662/ Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation Chew, C.S. Durairaj, R. Haseeb, A.S. Md. Abdul Beake, B. T Technology (General) TJ Mechanical engineering and machinery Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. W film after six times reflows were performed by nanoindentation. Design/methodology/approach - The characterization was carried at 25 degrees C, and 100 indents were generated. The elastic modulus and hardness were investigated. Findings - The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization. Originality/value - There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder. Emerald 2015 Article PeerReviewed application/pdf en http://eprints.um.edu.my/15662/1/Mechanical_properties_of_interfacial_phases_between_Sn-3.5_Ag_solder_and_Ni-18_at..pdf Chew, C.S. and Durairaj, R. and Haseeb, A.S. Md. Abdul and Beake, B. (2015) Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation. Soldering & Surface Mount Technology, 27 (2). pp. 90-94. ISSN 0954-0911 http://www.emeraldinsight.com/doi/full/10.1108/SSMT-01-2015-0001 10.1108/Ssmt-01-2015-0001
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
language English
topic T Technology (General)
TJ Mechanical engineering and machinery
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
Chew, C.S.
Durairaj, R.
Haseeb, A.S. Md. Abdul
Beake, B.
Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
description Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. W film after six times reflows were performed by nanoindentation. Design/methodology/approach - The characterization was carried at 25 degrees C, and 100 indents were generated. The elastic modulus and hardness were investigated. Findings - The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization. Originality/value - There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.
format Article
author Chew, C.S.
Durairaj, R.
Haseeb, A.S. Md. Abdul
Beake, B.
author_facet Chew, C.S.
Durairaj, R.
Haseeb, A.S. Md. Abdul
Beake, B.
author_sort Chew, C.S.
title Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
title_short Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
title_full Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
title_fullStr Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
title_full_unstemmed Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. W barrier film by nanoindentation
title_sort mechanical properties of interfacial phases between sn-3.5 ag solder and ni-18 at. w barrier film by nanoindentation
publisher Emerald
publishDate 2015
url http://eprints.um.edu.my/15662/1/Mechanical_properties_of_interfacial_phases_between_Sn-3.5_Ag_solder_and_Ni-18_at..pdf
http://eprints.um.edu.my/15662/
http://www.emeraldinsight.com/doi/full/10.1108/SSMT-01-2015-0001
_version_ 1643690101752987648
score 13.211869

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