Effects of Co nanoparticle addition to Sn-3.8Ag-0.7Cu solder on interfacial structure after reflow and ageing
Effects of Co nanoparticle additions to Sn-3.8Ag-0.7Cu on the structure of solder/copper interface have been studied after reflow and high temperature ageing (150 degrees C, up to 1008 h). Results show that the Co nanoparticles substantially suppress the growth of Cu(3)Sn but enhance Cu(6)Sn(5) grow...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
2011
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/5506/ |
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