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Methodology for thermal-mechanical modeling of damage and failure processes in through-silicon-vias

The reported failure of the Cu-filled via adjacent to the SiO2 liner of a TSV interconnect under thermal-mechanical stressing calls for a thorough quantitative investigation. In this respect, this paper presents a FE-based methodology to quantify the mechanics of deformation and failure processes of...

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书目详细资料
Main Authors:	Afripin, M. A. A., Yoon, C. K., Tamin, Mohd. Nasir
格式:	Conference or Workshop Item
出版:	2018
主题:	TJ Mechanical engineering and machinery
在线阅读:	http://eprints.utm.my/id/eprint/81882/ http://dx.doi.org/10.1109/IMPACT.2017.8255912
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