Damage mechanics of solder/IMC interface fracture in pb-free solder interconnects
This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ¿ of a material point in the solder/IMC interface, is expressed in terms of orthogonal traction components in a quadratic failure crit...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/15026/ http://dx.doi.org/10.1109/EPTC.2009.5416455 |
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