Effect of etching as pre-treatment for electroless copper plating on silicon wafer
Metallic coatings, such as copper films can be easily deposited on semiconductor materials like silicon wafer without prior surface pre-treatment using the electroless process. However, the adhesion of the copper film can be very weak and can easily peels off. In this study, the effect of etching in...
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| Main Authors: | , , , , |
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| Format: | Article |
| Published: |
Penerbit UTM Press
2017
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/76686/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-85032275598&doi=10.11113%2fjt.v79.10640&partnerID=40&md5=b5b98ce65503279f0aa063e6c1289236 |
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