封面图片

The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish

Surface finish is coated layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold ele...

Saved in:

书目详细资料
主要作者:	Jaidi, Zolhafizi
格式:	Thesis
语言:	English English English
出版:	2020
主题:	TK Electrical engineering. Electronics Nuclear engineering
在线阅读:	http://eprints.uthm.edu.my/1161/1/24p%20ZOLHAFIZI%20JAIDI.pdf http://eprints.uthm.edu.my/1161/2/ZOLHAFIZI%20JAIDI%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/1161/3/ZOLHAFIZI%20JAIDI%20WATERMARK.pdf http://eprints.uthm.edu.my/1161/
标签:	添加标签没有标签, 成为第一个标记此记录!

相似书籍

Intermetallic compound layer growth at the Interface between Sn-Ag and ENImAg surface finish
由: Mohamed Anuar, Rabiatul Adawiyah, et al.
出版: (2020)

Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper
由: M.A., Rabiatul Adawiyah, et al.
出版: (2017)

$Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model$

Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
由: Mohd. Yamin, Aliff Farhan
出版: (2012)

Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
由: Mohamed Anuar, Rabiatul Adawiyah
出版: (2017)

Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes
由: Tan, C. L., et al.
出版: (2006)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish
由: Osman, Saliza Azlina
出版: (2008)

Effect of surface finish metallurgy on intermetallic compuands during soldering with tin-silver-copper solders
由: Ourdjini, Ali, et al.
出版: (2008)

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
由: M.A., Rabiatul Adawiyah, et al.
出版: (2019)

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
由: M.A., Rabiatul Adawiyah, et al.
出版: (2018)

Study on interfacial reaction between lead-free solders and alternative surface finishes
由: Idris, Siti rabiatull aisha, et al.
出版: (2007)

Electrodeposition of lead‐free solder alloys
由: Goh, Y., et al.
出版: (2013)

Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
由: Wahab, Abdul Karim Abdul
出版: (2011)

Experimental and simulation study on lead-free solders and electroless nickel immersion silver surface finish
由: Hashim, Muhammad Syafiq
出版: (2023)

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
由: Boo, Nan Shing
出版: (2010)

Study of interfacial reactions between lead-free solders and immersion silver finish
由: Oshaghi, Safoura
出版: (2008)

Interfacial reactions between lead-free solders and electroless nickel
由: Mohd. Muzamir Mahat,
出版: (2009)

Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth
由: Muhammad Asyraf, Abdullah, et al.
出版: (2021)

Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
由: Bakir, Mohammed Luay
出版: (2012)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
由: Abu Hassan, Nurfazlin
出版: (2009)

Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
由: Binh, Duong Ngoc
出版: (2009)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
由: Idris, Siti Rabiatull Aisha
出版: (2008)

Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
由: M.A., Rabiatul Adawiyah, et al.
出版: (2020)

Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review
由: Nabila, Tamar Jaya, et al.
出版: (2019)

Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
由: Flora Somidin, et al.
出版: (2014)

Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
由: L.Chee Ping, Azrina A., et al.
出版: (2013)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
由: Muhammad Asyraf, Abdullah
出版: (2024)

Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
由: Ariff Syakirin, Ghazalli
出版: (2007)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
由: Muhammad Asyraf, Abdullah, et al.
出版: (2023)

The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth
由: Siti Rabiatull Aisha, Idris, et al.
出版: (2022)

The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish
由: Osman, Saliza Azlina, et al.
出版: (2014)

Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing
由: Ling, W.T., et al.
出版: (2017)

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
由: Zetty Akhtar, Abd Malek, et al.
出版: (2014)

Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish
由: Hardinnawirda, Kahar, et al.
出版: (2016)

Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes
由: F., Nor Akmal, et al.
出版: (2007)

Thermomigration in lead-free solder joints
由: Abdul Hamid, M. F, et al.
出版: (2008)

A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish
由: Leng, E.P., et al.
出版: (2017)

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys
由: Shnawah, D.A., et al.
出版: (2015)

Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
由: Tay, S.L., et al.
出版: (2013)

Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging
由: Zhou, Ding, et al.
出版: (2022)

Wettability of low silver content lead-free solder alloy
由: Dharma, I., et al.
出版: (2009)