Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing
In the recent years, lead-free solder material have been increasingly applied to the green semiconductor products for RoHS compliance. For Flip Chip Plastic Ball Grid Array (FCPBGA), recent industry trend is changing from ENIG pad finishing to Solder-on-pad (SOP) pad finishing using Sn3.0Ag0.5Cu to...
Saved in:
| Main Authors: | , , , |
|---|---|
| 格式: | |
| 出版: |
2017
|
| 在线阅读: | http://dspace.uniten.edu.my:80/jspui/handle/123456789/5267 |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|