Study of interfacial reactions between lead-free solders and immersion silver finish
Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2008
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| Online Access: | http://eprints.utm.my/id/eprint/9546/1/SafouraOshaghiMFKM2008.pdf http://eprints.utm.my/id/eprint/9546/ http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:847?site_name=Restricted Repository |
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