The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
Surface finish is coated layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold ele...
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| Format: | Thesis |
| Language: | English English English |
| Published: |
2020
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| Online Access: | http://eprints.uthm.edu.my/1161/1/24p%20ZOLHAFIZI%20JAIDI.pdf http://eprints.uthm.edu.my/1161/2/ZOLHAFIZI%20JAIDI%20COPYRIGHT%20DECLARATION.pdf http://eprints.uthm.edu.my/1161/3/ZOLHAFIZI%20JAIDI%20WATERMARK.pdf http://eprints.uthm.edu.my/1161/ |
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