Effect of surface finish metallurgy on intermetallic compuands during soldering with tin-silver-copper solders
Solder joint reliability is dependent on both thickness and morphology of the intermetallics that form and grow at the solder joint interface during soldering and subsequent thermal ageing and examining the morphology of these intermetallics is of great importance. The focus of this paper is to pres...
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| Main Authors: | , , |
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| Format: | Book Section |
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Penerbit UTM
2008
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/19351/ http://ieeexplore.ieee.org/document/5507773/?reload=true |
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