Study on interfacial reaction between lead-free solders and alternative surface finishes
This study investigates the interfacial reactions occurring during reflow soldering between Sn-Ag-Cu lead-free solder and two surface finishes: electroless nickel/ immersion gold (ENIG) and immersion silver (IAg). The study focuses on interfacial reactions evolution and growth kinetics of intermetal...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Published: |
2007
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/14491/ https://inis.iaea.org/search/search.aspx?orig_q=RN:41065656 |
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