Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review
Nowadays the application of laser technology in microelectronic packaging has been widely implemented in many developed countries. Its flexibility on setting the parameters by following individual’s requirement, localized heating, non-contact heating, fast heating and cooling rate makes it one of th...
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| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Language: | English English |
| Published: |
Universiti Malaysia Pahang
2019
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/27993/1/25.%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf http://umpir.ump.edu.my/id/eprint/27993/2/25.1%20Fibre%20laser%20soldering%20operation%20and%20its%20effect.pdf http://umpir.ump.edu.my/id/eprint/27993/ |
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