Stress effect on bond pad and fab of gold and copper wires / Nik Muhammad Fareez Wan Shah

This project is conducted using the explicit dynamics analysis, one of the analysis system under finite element method (FEM) to predict the stress behavior on free-air ball (FAB) of Au/Cu ball and Al bond pad during the impact stage in wirebonding process. Sometimes, there is a phenomena known as st...

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Bibliographic Details
Main Author: Wan Shah, Nik Muhammad Fareez
Format: Thesis
Language:English
Published: 2013
Subjects:
Online Access:https://ir.uitm.edu.my/id/eprint/98614/1/98614.pdf
https://ir.uitm.edu.my/id/eprint/98614/
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