Stress effect on bond pad and fab of gold and copper wires / Nik Muhammad Fareez Wan Shah
This project is conducted using the explicit dynamics analysis, one of the analysis system under finite element method (FEM) to predict the stress behavior on free-air ball (FAB) of Au/Cu ball and Al bond pad during the impact stage in wirebonding process. Sometimes, there is a phenomena known as st...
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| Format: | Thesis |
| Language: | English |
| Published: |
2013
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| Online Access: | https://ir.uitm.edu.my/id/eprint/98614/1/98614.pdf https://ir.uitm.edu.my/id/eprint/98614/ |
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