Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue

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Bibliographic Details
Main Authors: Mohd Nasir Tamin,, Liew, Yek Ban
Format: Article
Language:English
Published: Penerbit UKM 2008
Online Access:http://journalarticle.ukm.my/2566/1/2008-9.pdf
http://journalarticle.ukm.my/2566/
http://www.ukm.my/jkukm/index.php/jkukm
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