Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint
Eutectic Sn-Bi alloy is acquiring significant observation in the electronic packaging industry because of its advantageous properties such as ductility, low melting temperature, and mechanical strength. Miniaturization of electronic devices requires solder paste having a low melting temperature for...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Published: |
Springer
2023
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/38677/ |
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