Solder joint fatigue in a surface-mount assembly subjected to mechanical loading
A mechanical approach employing cyclic twisting deformation to a surface mount assembly is examined as an alternative to temperature cycling for evaluating solder joints fatigue performance. This highly accelerated test is aimed at reducing solder joint reliability testing cycle time. In this study,...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2005
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/7096/ http://www.scopus.com |
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