Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arran...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Kebangsaan Malaysia
2005
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/470/1/cem05-039_MNTamin__Ed_3.pdf http://eprints.utm.my/id/eprint/470/ |
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