Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes therm...
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| Main Authors: | , |
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| Format: | Citation Index Journal |
| Published: |
IJSER
2011
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| Subjects: | |
| Online Access: | http://eprints.utp.edu.my/7503/1/Effect_of_Temperature_on_Deformation_Characteristics_of_Gold_Ball_Bond_in_Au-Al_Thermosonic_Wire_Bonding.pdf http://dx.doi.org/10.4236/jsemat.2011.13018 http://eprints.utp.edu.my/7503/ |
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