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Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding

Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes therm...

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Bibliographic Details
Main Authors: Singh, Gurbinder, Mamat, Othman
Format: Citation Index Journal
Published: IJSER 2011
Subjects:
Q Science (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.utp.edu.my/7503/1/Effect_of_Temperature_on_Deformation_Characteristics_of_Gold_Ball_Bond_in_Au-Al_Thermosonic_Wire_Bonding.pdf
http://dx.doi.org/10.4236/jsemat.2011.13018
http://eprints.utp.edu.my/7503/
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spelling my.utp.eprints.75032017-01-19T08:23:26Z Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding Singh, Gurbinder Mamat, Othman Q Science (General) TJ Mechanical engineering and machinery Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation characteristics of gold ball bonding IJSER 2011 Citation Index Journal PeerReviewed application/pdf http://eprints.utp.edu.my/7503/1/Effect_of_Temperature_on_Deformation_Characteristics_of_Gold_Ball_Bond_in_Au-Al_Thermosonic_Wire_Bonding.pdf http://dx.doi.org/10.4236/jsemat.2011.13018 Singh, Gurbinder and Mamat, Othman (2011) Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding. [Citation Index Journal] http://eprints.utp.edu.my/7503/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
topic Q Science (General)
TJ Mechanical engineering and machinery
spellingShingle Q Science (General)
TJ Mechanical engineering and machinery
Singh, Gurbinder
Mamat, Othman
Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
description Wire bonding is a process that is used to form solid-state bonds to interconnect metals such as gold wires to metalized pads deposited on silicon integrated circuits. Typically, there are 3 main wire bonding techniques; Thermo-compression, Ultrasonic and Thermosonic. This experiment utilizes thermosonic bonding which applies heat, ultrasonic energy and force on an Au-Al system. Sixteen groups of bonding conditions at various temperature settings were compared to establish the relationship between ball deformation and temperature. The results of this study will clearly indicate the effects of applied bonding temperature towards bond strength and deformation characteristics of gold ball bonding
format Citation Index Journal
author Singh, Gurbinder
Mamat, Othman
author_facet Singh, Gurbinder
Mamat, Othman
author_sort Singh, Gurbinder
title Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
title_short Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
title_full Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
title_fullStr Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
title_full_unstemmed Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding
title_sort effect of conduction pre-heating in au-al thermosonic wire bonding
publisher IJSER
publishDate 2011
url http://eprints.utp.edu.my/7503/1/Effect_of_Temperature_on_Deformation_Characteristics_of_Gold_Ball_Bond_in_Au-Al_Thermosonic_Wire_Bonding.pdf
http://dx.doi.org/10.4236/jsemat.2011.13018
http://eprints.utp.edu.my/7503/
_version_ 1738655582741594112
score 13.211869

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