Study of interfacial reactions between lead-free solders and immersion silver finish

Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...

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Bibliographic Details
Main Author: Oshaghi, Safoura
Format: Thesis
Language:English
Published: 2008
Subjects:
Online Access:http://eprints.utm.my/id/eprint/9546/1/SafouraOshaghiMFKM2008.pdf
http://eprints.utm.my/id/eprint/9546/
http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:847?site_name=Restricted Repository
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