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Study of interfacial reactions between lead-free solders and immersion silver finish

Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for...

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Main Author: Oshaghi, Safoura
Format: Thesis
Language:English
Published: 2008
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/9546/1/SafouraOshaghiMFKM2008.pdf
http://eprints.utm.my/id/eprint/9546/
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spelling my.utm.95462018-07-19T01:51:23Z http://eprints.utm.my/id/eprint/9546/ Study of interfacial reactions between lead-free solders and immersion silver finish Oshaghi, Safoura TJ Mechanical engineering and machinery Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for ball-grid-array (BGA) interconnects in the microelectronic packaging industry. Among the various surface finishes available, electroless nickel/immersion gold (ENIG) is the most appealing at the moment. However, because of their black pad problem, immersion silver is being considered as an alternative surface finish. Doping elements such as Ni in solder alloys may lead to an increase in the undercooling during solidification thus affecting the growth of intermetallics. This project is carried out to investigate the intermetallics (IMC) formation during soldering between lead-free solders (Sn-3.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu-0.1Ni, Sn-3.0Ag-0.5Cu-0.05Ni, Sn-3.5Ag and Sn-0.75Cu) and Immersion Silver surface finish, using solder size of 500 m. Top surface morphology and EDX (Energy-Dispersive X-Ray) results show that there are basically two types of intermetallics that were formed. Isothermal aging up to 2000 hrs results in larger and coarser IMCs. Also observed were the thickness of intermetallics that increased along with the aging time. In addition the present study also confirmed that doping SAC solders with small amounts of Ni caused finer microstructures compared to SAC305 solder without Ni doping element, resulting in thinner IMC s and smaller grain sizes. 2008-11 Thesis NonPeerReviewed application/pdf en http://eprints.utm.my/id/eprint/9546/1/SafouraOshaghiMFKM2008.pdf Oshaghi, Safoura (2008) Study of interfacial reactions between lead-free solders and immersion silver finish. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering. http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:847?site_name=Restricted Repository
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Oshaghi, Safoura
Study of interfacial reactions between lead-free solders and immersion silver finish
description Due to environmental considerations the use of lead-free solders has become common in electronic packaging industry. Among various lead-free solders available, near-eutectic Sn-Ag-Cu alloys are considered the most promising replacement of Sn Pb solders, and are widely used as lead-free solutions for ball-grid-array (BGA) interconnects in the microelectronic packaging industry. Among the various surface finishes available, electroless nickel/immersion gold (ENIG) is the most appealing at the moment. However, because of their black pad problem, immersion silver is being considered as an alternative surface finish. Doping elements such as Ni in solder alloys may lead to an increase in the undercooling during solidification thus affecting the growth of intermetallics. This project is carried out to investigate the intermetallics (IMC) formation during soldering between lead-free solders (Sn-3.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu-0.1Ni, Sn-3.0Ag-0.5Cu-0.05Ni, Sn-3.5Ag and Sn-0.75Cu) and Immersion Silver surface finish, using solder size of 500 m. Top surface morphology and EDX (Energy-Dispersive X-Ray) results show that there are basically two types of intermetallics that were formed. Isothermal aging up to 2000 hrs results in larger and coarser IMCs. Also observed were the thickness of intermetallics that increased along with the aging time. In addition the present study also confirmed that doping SAC solders with small amounts of Ni caused finer microstructures compared to SAC305 solder without Ni doping element, resulting in thinner IMC s and smaller grain sizes.
format Thesis
author Oshaghi, Safoura
author_facet Oshaghi, Safoura
author_sort Oshaghi, Safoura
title Study of interfacial reactions between lead-free solders and immersion silver finish
title_short Study of interfacial reactions between lead-free solders and immersion silver finish
title_full Study of interfacial reactions between lead-free solders and immersion silver finish
title_fullStr Study of interfacial reactions between lead-free solders and immersion silver finish
title_full_unstemmed Study of interfacial reactions between lead-free solders and immersion silver finish
title_sort study of interfacial reactions between lead-free solders and immersion silver finish
publishDate 2008
url http://eprints.utm.my/id/eprint/9546/1/SafouraOshaghiMFKM2008.pdf
http://eprints.utm.my/id/eprint/9546/
http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:847?site_name=Restricted Repository
_version_ 1643645184739639296
score 13.211869

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