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Damage mechanics of solder/IMC interface fracture in pb-free solder interconnects

This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, Â¿ of a material point in the solder/IMC interface, is expressed in terms of orthogonal traction components in a quadratic failure crit...

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書誌詳細
主要な著者:	Tamin, Mohd. Nasir, Bo, Lai Zheng, Keat, Loh Wei
フォーマット:	Conference or Workshop Item
出版事項:	2009
主題:	TJ Mechanical engineering and machinery
オンライン･アクセス:	http://eprints.utm.my/id/eprint/15026/ http://dx.doi.org/10.1109/EPTC.2009.5416455
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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