Damage mechanics of solder/IMC interface fracture in pb-free solder interconnects

This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ¿ of a material point in the solder/IMC interface, is expressed in terms of orthogonal traction components in a quadratic failure crit...

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Main Authors: Tamin, Mohd. Nasir, Bo, Lai Zheng, Keat, Loh Wei
格式: Conference or Workshop Item
出版: 2009
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在线阅读:http://eprints.utm.my/id/eprint/15026/
http://dx.doi.org/10.1109/EPTC.2009.5416455
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