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Research development of solder materials and its intermetallic compound (IMC) study

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Bibliographic Details
Main Authors: Mohd Arif Anuar, Mohd Salleh, Najib S., Ibrahim, Saud, N., Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Scientific.Net/Trans Tech Publications 2014
Subjects:
Composite
Intermetallic compound
Lead-Free solder
Solder fabrication
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033
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http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033

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