Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electroni...
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| Main Authors: | , , , , , |
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| Format: | Review |
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Elsevier Editora Ltda
2024
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