Solder bump strength and failure mode of low-k flip chip device
In this paper, the failure mode and solder bump strength for low-k flip chip devices were determined using die pull technique. The results show there is no significant difference between low-k and non low-k devices in terms of bumps strength for the amount of taffy in this device. However, there is...
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| Main Authors: | , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5305 |
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