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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection technology for flip chip package is getting finer and smaller, it is extrem...

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Bibliographic Details
Main Authors: Kar Y.B., Talik N.A., Sauli Z., Fei J.S., Retnasamy V.
Other Authors: 26649255900
Format: Article
Published: 2023
Subjects:
ABAQUS
Finite element analysis
Flip chip
Solder ball
Stress (materials)
Thermal analysis
Electronics packaging
Finite element method
Flip chip devices
Soldering
Stress concentration
Thermal stress
Thermoanalysis
ABAQUS software
Design/methodology/approach
Direct measurement
Elasto-plastic analysis
Electronic Packaging
Experimental measurements
Finite element method FEM
Finite element models
Flip chip ball grid array
Flip-chip packages
High stress
Interconnection technology
Lead-Free
Plain strain
SAC-solders
Solder balls
Solder Bump
Solder interconnections
Stress(materials)
Thermal distributions
Thermal induced stress
Thermal loadings
Thermal stress effects
Thermal conductivity
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