Endut, Z. (2017). Solder bump strength and failure mode of low-k flip chip device.
シカゴスタイル引用形Endut, Z. Solder Bump Strength and Failure Mode of Low-k Flip Chip Device. 2017.
MLA引用形式Endut, Z. Solder Bump Strength and Failure Mode of Low-k Flip Chip Device. 2017.
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