Flip-Chip Bonding Using Laser Induced Ultrasonic Vibration
Current thermosonic flip chip bonding technologies are adversely affected by chip-to-substrate co-planarity errors and bump/pad height variations which can lead to uneven bonding strength and, in extreme cases, chip cratering. This has limited the industrial uptake of thermosonic flip chip assembly....
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| Format: | Thesis |
| Language: | English |
| Published: |
UTeM
2016
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| Online Access: | http://eprints.utem.edu.my/id/eprint/18846/1/Flip-Chip%20Bonding%20Using%20Laser%20Induced%20Ultrasonic%20Vibration%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/18846/ http://library.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000102296 |
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http://eprints.utem.edu.my/id/eprint/18846/1/Flip-Chip%20Bonding%20Using%20Laser%20Induced%20Ultrasonic%20Vibration%2024%20Pages.pdfhttp://eprints.utem.edu.my/id/eprint/18846/
http://library.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000102296