Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump
In electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) solder bump system, the nickel UBM and solder deposition aspects, are two of the most important factors affecting the stability of solder joints. In this study solder bump shearing strength, materials interaction and inter-metal...
保存先:
| 主要な著者: | , , , |
|---|---|
| フォーマット: | |
| 出版事項: |
2017
|
| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5322 |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|