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Development of insulated Cu wire ball bonding

Insulated Cu wire is the next generation technology in fine pitch and high density wire bonding, which enables wire crossing and touching without concern for wire-to-wire shorts. However, insulated Cu wire bonding is still at the infant stage compared to Cu wire bonding. This study investigates the...

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书目详细资料
Main Authors:	Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.
其他作者:	55787052600
格式:	Conference paper
出版:	2023
主题:	Bonding Electronics packaging Industrial electronics Manufacture Technology Bond structures Bonding parameters Bonding strength Cu-wire bondings Electric flame-off (EFO) Generation technologies Pad craterings Wire pull strength Wire
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